Cu wire bonding implementation requires a package and system level understanding. ASMPT’s commitment in continuous learning has been vital in expanding Cu knowledge base and wisdom in process, material, packaging, reliability and FA. This makes ASM Cu wire bonding technology incomparable.
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Wire Bonding
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CAE Simulation Study?
Advanced CAE simulation tools for process and stress prediction. ?Interaction between the process variables and its significance are studied using simulation tools and validated with experiments.
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ASMPT’s Enhanced Cu Process
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Advanced Characterisation Competency
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Failure Analysis Competency
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